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For the 18th year in a row, Apple has been named the World’s Most Admired Company by Fortune magazine.

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The Fortune survey involves 3,380 business leaders from various sectors. They rate companies on nine different aspects such as innovation, how good they are for investors, how responsible they are towards society, and how well they attract new employees. Apple came out on top, with Microsoft and Amazon right behind, continuing their tradition of being among the best.

This year’s 2025 rankings show that tech companies are still leading the pack. Nvidia has climbed to fourth place, a first for them, thanks to their big role in the world of artificial intelligence and making graphics processing units. Nvidia’s chips are key in the AI models created by companies like OpenAI, Google, and Microsoft.

However, it’s not just tech; other types of companies are also doing well. Berkshire Hathaway, Costco, and JPMorgan Chase are also in the top seven. New entries this year in the top 50 include ServiceNow, Taiwan Semiconductor, and Novo Nordisk. An interesting point from this year’s list is that all ten of the highest-ranked companies are from the United States, showing a strong American presence at the top for the second year running.

The landscape of technology manufacturing is shifting. A significant development in this shift is the near completion of the first US-based facility dedicated to producing A-series chips for Apple devices. This move, hailed as a victory for domestic production, comes alongside new security concerns regarding iPhone vulnerabilities and evolving scam tactics.

The journey towards “Made in America” Apple chips began in 2022, spurred by the US CHIPS Act. This government initiative aims to reduce American reliance on overseas chip production, particularly in China, and to stimulate domestic job creation. The plan involves establishing several TSMC (Taiwan Semiconductor Manufacturing Company) fabrication plants in Arizona, with some production lines specifically allocated for Apple’s processors, initially for older devices.

While initial projections aimed for mass production to commence in 2024, the project faced delays, pushing the timeline into the current year. Further, the production of more advanced 2nm chips has been postponed until 2028. Early concerns arose about the practicality of the initial plant, with worries that the output would need to be shipped back to Taiwan for the crucial “packaging” process, which integrates various circuit boards into a single chip. However, Apple later addressed this by announcing plans for a US-based packaging facility.

The construction of these plants has not been without controversy. TSMC’s hiring practices have drawn criticism, with a significant number of workers being brought in from Taiwan rather than being recruited locally in the US. While the company initially explained this as a temporary measure during the construction phase, the situation persisted, leading to accusations of “anti-American discrimination” and even a lawsuit.

Despite these challenges, a recent report suggests that the first plant is on the verge of commencing mass production. This implies that test production has already been successfully completed, with Apple now in the final stages of verifying the quality of the chips produced in Arizona. The first commercially mass-produced chips are anticipated as early as this quarter, pending the completion of final quality assurance checks. This marks a significant milestone in bringing chip production back to American soil.

Security Vulnerabilities and Evolving Scams: A Double-Edged Sword

While the news of domestic chip production offers a positive outlook, recent discoveries have highlighted potential security vulnerabilities in iPhones. A security researcher, Thomas Roth, identified a vulnerability in the USB-C controller chip present in the iPhone 15 and 16 models. This vulnerability, in theory, could be exploited to compromise an iPhone.

The vulnerability lies within the ACE3 USB-C controller, a chip introduced in 2023, which manages power delivery and acts as a sophisticated microcontroller with access to critical internal systems. Roth’s team demonstrated the ability to gain code execution on the ACE3 chip by carefully measuring electromagnetic signals during the chip’s startup process and using electromagnetic fault injection to bypass firmware validation checks. This could, theoretically, grant an attacker complete control over the device.

However, exploiting this vulnerability is exceptionally complex and requires physical access to the device. Both Apple and Roth himself have concluded that it does not pose a realistic threat to users in real-world scenarios.

A more pressing security concern involves evolving tactics used by scammers exploiting iMessage. Scammers commonly use SMS and iMessage to distribute phishing links and attempt to install malware. To combat this, iPhones automatically disable links in messages received from unknown senders. These links appear as plain text and are not tappable.

However, scammers have devised a workaround. By enticing users to reply to their messages, even with a simple “STOP” command, they can bypass this protection. Replying to the message, even with a single character, signals to the iPhone that the user has interacted with the sender, thus legitimizing the message and re-enabling the links. This means users are tricked into making the links live themselves.

This tactic has become increasingly prevalent, with numerous examples of fraudulent messages impersonating legitimate organizations like USPS or toll road companies. These messages often prompt users to reply with a single character, such as “Y,” to activate the malicious links.

Staying Safe in a Digital World

In light of these evolving threats, users must remain vigilant. The most effective way to protect oneself is to exercise extreme caution with links received in any form of electronic communication. Never click on links in emails, text messages, or other messages unless you are absolutely certain of their legitimacy.

A best practice is to rely on saved bookmarks or manually type URLs into your browser, especially for sensitive websites. If you have any doubts about the authenticity of a message, contact the purported sender directly using known contact information to verify its legitimacy. These simple precautions can significantly reduce the risk of falling victim to scams and compromising your personal information.

For years, the intricate dance of microchip manufacturing has played out largely overseas, a complex global ballet involving specialized factories and intricate supply chains. But the landscape is shifting, and a significant new act is unfolding in the Arizona desert.

Recent reports indicate that Apple has begun manufacturing its sophisticated S9 chip, the powerhouse behind the Apple Watch, on American soil for the very first time. This move marks a pivotal moment, not just for Apple, but for the broader semiconductor industry in the United States.   

The news centers around TSMC’s advanced Fab 21 plant near Phoenix. TSMC, the Taiwanese Semiconductor Manufacturing Company, is a global giant in chip production, and their Arizona facility represents a major strategic expansion beyond their home base. This plant, already producing the A16 Bionic chip that powers certain iPhone models, has now added the S9 to its repertoire.  

The S9 chip, which debuted in the Apple Watch Series 9 and continues to drive the Apple Watch Ultra 2, is a marvel of miniaturization. It’s a System-in-Package (SiP), meaning multiple components are integrated into a single, compact unit. This intricate design, based on processing features derived from the A16, demands cutting-edge manufacturing processes.

Both the A16 and the S9 are built using TSMC’s 4-nanometer process technology, often referred to simply as “N4.” This shared technological foundation is key to understanding the recent shift in production. The fact that both chips utilize the same advanced technology has enabled TSMC to efficiently adapt its Arizona production line to accommodate the S9 alongside the A16. It’s like a well-oiled machine, smoothly transitioning to produce a similar, yet distinct, product.  

This development signifies more than just a change in location. It reflects a broader trend of bringing semiconductor manufacturing back to the United States. The strategic importance of domestic chip production has become increasingly clear in recent years, particularly in light of global supply chain disruptions and geopolitical considerations. Having a domestic source for these critical components reduces reliance on overseas production and strengthens national technological independence.  

The TSMC Arizona facility is still relatively young, with production capacity in its early stages. The current phase of operation, known as Phase 1A, has a monthly output of approximately 10,000 wafers. These wafers, the raw material for chip production, are shared between Apple’s A16 and S9 chips, as well as other clients like AMD.

Each wafer can yield hundreds of individual chips, depending on factors like chip size, design complexity, and overall production efficiency. Imagine these wafers as large sheets of silicon, meticulously etched with intricate circuits to create the tiny processors that power our devices.

The next phase of development, Phase 1B, is expected to significantly boost the facility’s capacity. Projections indicate a doubling of output to 24,000 wafers per month. This expansion represents a substantial investment in American manufacturing and a commitment to growing the domestic semiconductor industry.

The production of Apple’s S9 chip in Arizona is a significant milestone. It’s a testament to the advancements in American manufacturing capabilities and a sign of things to come. This move not only strengthens Apple’s supply chain but also contributes to the revitalization of the U.S. semiconductor sector, bringing high-tech jobs and expertise to American soil. It’s a story of innovation, strategic planning, and the ongoing evolution of the global technology landscape, playing out in the heart of the Arizona desert.

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For years, Apple has championed the System-on-a-Chip (SoC) design for its processors, a strategy that has delivered impressive performance and power efficiency in iPhones, iPads, and Macs. This design, which integrates the CPU, GPU, and other components onto a single die, has been a cornerstone of Apple’s hardware advantage.

However, whispers from industry insiders suggest a potential shift in this approach, particularly for the high-performance M-series chips destined for professional-grade Macs. Could we be seeing a move towards a more modular design, especially for the M5 Pro and its higher-end counterparts?

The traditional computing landscape involved discrete components – a separate CPU, a dedicated GPU, and individual memory modules, all residing on a motherboard. Apple’s SoC approach revolutionized this, packing everything onto a single chip, leading to smaller, more power-efficient devices.

This integration minimizes communication latency between components, boosting overall performance. The A-series chips in iPhones and the M-series chips in Macs have been prime examples of this philosophy. These chips, like the A17 Pro and the M3, are often touted as single, unified units, even if they contain distinct processing cores within their architecture.

But the relentless pursuit of performance and the increasing complexity of modern processors might be pushing the boundaries of the traditional SoC design. Recent speculation points towards a potential change in strategy for the M5 Pro, Max, and Ultra chips.

These rumors suggest that Apple might be exploring a more modular approach, potentially separating the CPU and GPU onto distinct dies within the same package. This wouldn’t be a return to the old days of separate circuit boards, but rather a sophisticated form of chip packaging that allows for greater flexibility and scalability.

One key factor driving this potential change is the advancement in chip packaging technology. Techniques like TSMC’s SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal) offer the ability to combine multiple dies within a single package with exceptional thermal performance.

This means that the CPU and GPU, even if physically separate, can operate at higher clock speeds for longer durations without overheating. This improved thermal management is crucial for demanding workloads like video editing, 3D rendering, and machine learning, which are the bread and butter of professional Mac users.

Furthermore, this modular approach could offer significant advantages in terms of manufacturing yields. By separating the CPU and GPU, Apple can potentially reduce the impact of defects on overall production. If a flaw is found in the CPU die, for instance, the GPU die can still be salvaged, leading to less waste and improved production efficiency. This is particularly important for complex, high-performance chips where manufacturing yields can be a significant challenge.

This potential shift also aligns with broader trends in the semiconductor industry. The increasing complexity of chip design is making it more difficult and expensive to cram everything onto a single die. By adopting a more modular approach, chipmakers can leverage specialized manufacturing processes for different components, optimizing performance and cost.

Interestingly, there have also been whispers about similar changes potentially coming to the A-series chips in future iPhones, with rumors suggesting a possible separation of RAM from the main processor die. This suggests that Apple might be exploring a broader shift towards a more modular chip architecture across its entire product line.

Beyond the performance gains for individual devices, this modular approach could also have implications for Apple’s server infrastructure. Rumors suggest that the M5 Pro chips could play a crucial role in powering Apple’s “Private Cloud Compute” (PCC) servers, which are expected to handle computationally intensive tasks related to AI and machine learning. The improved thermal performance and scalability offered by the modular design would be particularly beneficial in a server environment.

While these are still largely speculative, the potential shift towards a more modular design for Apple Silicon marks an exciting development in the evolution of chip technology. It represents a potential departure from the traditional SoC model, driven by the need for increased performance, improved manufacturing efficiency, and the growing demands of modern computing workloads. If these rumors prove true, the future of Apple Silicon could be one of greater flexibility, scalability, and performance, paving the way for even more powerful and capable Macs.

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