Samsung has recently appointed the former TSMC expert – Lin Jun-cheng as the Senior Vice President of chip packaging. As per the details, the chief will work under Samsung’s chip business division, Device Solutions.
On the other hand, another report suggests that the former TSMC expert will mainly look after the development of cutting-edge packaging technology, in the Samsung chip industry. Eventually, this plays a key role in enhancing advanced higher-performance chipsets.
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For your information, Lin worked at TSMC from 1999 to 2017. Thereafter, he served as CEO of Taiwanese semiconductor equipment maker Skytech. It shows how Samsung beefs up efforts to strengthen its prowess in chip packaging under the leadership of Samsung’s co-CEO Kyung Kye-hyun.
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In recent times, the Korean tech maker established a dedicated team as part of research and development on its dream chipset. To speed up the development and accuracy of the project, the company is continuously putting in efforts and hiring expertise from various tech titans.
(Via – SammyFans)