Recently it was reported that HiSilicon, the Huawei chip-making subsidiary is planning for advanced research on-chip. And now, according to the latest news, the company has registered for a new patent related to chip-making technology.
Huawei has disclosed a new patent related to laser chips on July 06, 2021, under the publication number CN113054528A. The company has initially applied for the patent on December 12, 2019. The Chinese OEM has been working on chip making for a long time. And the company keeps on searching for new and advanced technologies.
Coming back to the patent application, the module in the laser chip consists of the following components.
- Lease Chip main body
- DML area (direct-adjusted laser )
- MZI filter area(Mach-Zehnder interferometer)
- Isolation area
In contrast to the technology, the isolation area is placed between the DML and MZI to separate them. The DML will work as a light source and the MZI as a filter to create filtering effects.
Moreover, the DML area and the MZI filter area exist in the chip in a monolithic integrated layout and the MZI filter zone consists of at least one MZI. This system aims to provide a lesser chirp frequency of the laser and amplifies the signal broadcasting measure by integrating it together with the DML area and the MZI filter area on the module.
(Via)
