ASRock released the Z590 OC Formula motherboard, the official stated that overclocking master Nick Shih once again worked to integrate advanced technologies in various fields into this mass-produced motherboard.
This generation of exterior styling uses a unique metallic paint, matched with the sharp lines on the XXL heat sink fins. In addition, the array type OC Button and OLED display also add a few mechanical elements and modernity to it.
In order to realize the ultimate performance, this generation of Z590 OC Formula uses a 12-layer PCB with server-grade LOW LOSS and adopts the PCB Backdrill process to eliminate the problem of signal attenuation caused by the residual hole wall of the previous multi-layer board.
And at the same time Improve impedance matching and increase signal strength. Additionally to the CPU, the impact of memory on performance cannot be ignored. The new generation of SMD TYPE DIMM Slot avoids the problem of signal loss caused by residual DIMM pins.
With the advantages of the multi-layer board itself, the Z590 OC Formula can be used better. Wiring separates signals and reduces mutual interference and distortion between signals. Better performance means a better power supply module. OC Formula is equipped with 16 90A smart power stage modules on the power supply, which is equivalent to providing a current of up to 1440 amperes for the CPU.
OC Formula is also equipped with high-speed network chips Intel 2.5GbE LAN and WiFi 6e. WiFi 6e expands the frequency band to 6GHz, bringing higher performance, lower latency, and faster data rates, and allows more downlink data to be transmitted simultaneously. The ESS 9218 DAC & Wima audio caps on the board provide Hi-Fi audio and support headphones with an impedance of up to 600 Ω.
(Via)
