Recently, Samsung Electronics has entered into a semiconductor manufacturing agreement with Intel through US IT Media. In the second half of this year, Intel will produce 15,000 300mm wafers per month at Samsung Austin Foundry Factory.
Because the Austin plant has 14-nano process technology, the product chip is a graphics processing unit (GPU) rather than a central processing unit (CPU).
In the future, when the expansion of the second plant in Austin is completed, it is likely that high value-added products will be mass-produced in the 5 nano or more advanced process.
Earlier, the new CEO of Intel, said, “We are considering whether to leave the traditional method and leave the production to an outsourcer such as TSMC.” He said Intel would have difficulty in introducing microfabrication of 7nm or less as there is scope for the production of goods.
TSMC and Samsung are the only companies in the world that can produce chips of 10nm or less. AMD, which competes with Intel in the Central Processing Unit (CPU) market, produces products of 7 Nm or less through TSMC.
The industry believes that Intel has placed more weight on TSMC than Samsung for foundry production. This is because TSMC is considered to be more technologically advanced than Samsung Electronics.
Semae Accurit analyzed that Intel has entered into agreements with TSMC and Samsung Electronics. These parallel agreements gain the power of price bargaining over monopoly agreements and reduce production uncertainty. As TSMC’s Arizona plant prepares for 2023, it realizes that it needs Mainland partners between 2021 and 2022.