Honor will launch its Magic 3 series of phones on August 12 and these smartphones will debut the Snapdragon 888 Plus chipset. According to the latest info, the official case of Magic 3 has been surfaced, which further makes us think about its rear design.
As per the case, it has a wide rear camera circular opening where the company will put different camera lenses. From the case, the camera system of the smartphone gives us a feel of Huawei’s Mate series devices.
Moreover, the Honor and Qualcomm CEO have attended the interview at Reuters, to talk about their partnership for the Snapdragon 888 Plus is used in the Magic 3 phones. The Honor CEO, George Zhao has revealed the two colorways for the Magic 3.
You can take a look at those two colorways of Magic 3 explained:
— HONOR (@Honorglobal) July 22, 2021
Honor Magic 3, 3 Pro Specifications:
Along with the latest and the most powerful Snapdragon 888 SoC, the Honor Magic 3 will come with several high-end features including a giant circular rear camera.
Furthermore, the Honor Magic 3 will come with a curved edge display and a punch-hole camera setup. It will sport a 6.76-inch display. This base model will come with a 12GB RAM option and a quad rear camera setup.
This device will have support for 66W fast charging. Further, there is not known much about this base model and we will get more updates on it in the coming time.
The Honor Magic 3 Pro is said to feature a high-resolution display with a 1228p high-resolution display. As the high-end variant of the series, it will feature a periscope telephoto lens with 100x zoon support.
Further, it is expected to bring a much improved low-light photography experience. The device will come with a 100W fast charging support and a 50W wireless fast charging support. Further details about the handset will be known in the coming days.