Huawei Mate X3– Huawei’s next foldable smartphone has appeared on the web over a few weeks. And we have received a bunch of leaks and news related to it. However, the company has not confirmed or announced any information about the release of the new-generation folding phone.
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Recently, the Huawei phone with the code name PAL-AL00 has obtained the MIIT certification, which is reported to be Mate X3. The listing discloses that it is equipped with HarmonyOS and supports 4G networks.
In a recent development, a Weibo tipster has come up with another piece of news about the Huawei Mate X3, it features outward folding and punch hole design on the right-side display. Further, another digital blogger mentioned that the upcoming Mate X3 will have a large size display than the flagship Mate 50 series.
It seems that Huawei is again continuing the outward folding design with Mate X3, which was discontinued Mate X2 and P50 Pocket. For your information, the Mate X2 was launched with an inward fold design and P50 Pocket arrived with a vertical fold design.
Huawei is facing a shortage of Kirin chipsets and started using Snapdragon processors. A few days ago, it was reported Huawei is testing Mate X3 with Kirin 9000 and HarmonyOS 2.0.1 operating system.
So, we can assume that there are two variants of Mate X3 similar P50 series powered by Kirin 9000 and Snapdragon 8 Gen 1 processors. Either, there could be only one version equipped with Kirin 9000 4G chipset.
At present, Huawei has developed only testing models of Mate X3. We don’t have information regarding the mass production of this device. More information is yet to come, until then stay connected with us for more exciting information.
